Showing posts with label FSII. Show all posts
Showing posts with label FSII. Show all posts

Wednesday, March 21, 2012

FSI International Inc (Nasdaq: FSII) shares rise on strong Q2 results

FSI International Inc (Nasdaq: FSII) shares rise on strong Q2 resultsTallahassee, FL 3/21/12 (StreetBeat) -- Shares of FSI International Inc (Nasdaq:FSII) rose as much as 18 percent a day after the chip-equipment maker posted better-than-expected quarterly results, helped by demand from international customers.

Shares of Minneapolis-based FSI were trading at $5.24 in morning trade on Wednesday on the Nasdaq.

The company said it was expecting an increase in revenue and a gain in market share in fiscal 2012.

"Strong adoption of single-wafer products at multiple customers is driving growth," Needham analyst Edwin Mok said in a research note to clients.

Please contact www.thestreetbeat.com for interest in our latest investor relations platform the “CEO Interview Series” with its host Steve Kanaval. The package includes a one-on-one interview with a seasoned industry professional; published segment to our web site with embedded audio/video file; and a compressed file that can be easily e-mailed out to your current and/or potential investors. Please e-mail bflautt@gmail.com or call (662) 392-0740 for pricing and scheduling.

StreetBeat Disclaimer

Distributed by Viestly

Thursday, December 1, 2011

FSI International Receives Follow-On Orders for Its ORION® System from Leading Semiconductor Producers

FSI International Receives Follow-On Orders for Its ORION® System from Leading Semiconductor ProducersPalm Beach, FL 12/1/11 (StreetBeat) --FSI International, Inc. (Nasdaq: FSII), a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced today that it received follow-on orders for its ORION® Single Wafer Cleaning System from two leading semiconductor producers. One customer will use the ORION® System for FEOL all-wet photoresist stripping applications, using the high-temperature ViPR™ process, and the other customer will use the system for BEOL applications. The company expects to ship these systems in fiscal 2012.*

Leading integrated circuit manufacturers are finding that the unique closed chamber design of the ORION® System, when used for FEOL applications, permits use of high-temperature ViPR™ process technology for all-wet removal of highly implanted photoresist. FSI's differentiated ViPR™ technology minimizes material loss, lowers defectivity and has proven cost of ownership advantages. Other leading device manufacturers recognize that the closed chamber technology of the ORION® System, when used for BEOL applications, delivers highly efficient removal of etch and ash by-products without causing galvanic corrosion or changes in metal and dielectric film properties. The process chamber design with an integrated spray bar, improves uniformity, shortens process time, reduces chemical consumption and enhances particle removal.

FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray and cryogenic aerosol technologies, customers are able to achieve their process performance flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment.

StreetBeat Disclaimer

Distributed by Viestly

Monday, November 14, 2011

FSI International Announces Receipt of Multiple ANTARES® Orders

FSI International Announces Receipt of Multiple ANTARES® OrdersTallahassee, FL 11/14/11 (StreetBeat) --FSI International, Inc. (Nasdaq: FSII), a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced today that several semiconductor producers have placed additional orders for ANTARES® Cryokinetic Cleaning Systems. These device providers currently use the ANTARES® systems for numerous particle removal processes. Unlike aqueous technologies, Cryokinetic cleaning technology is uniquely qualified for particle removal application because of its all-dry defect removal method. The systems are expected to ship during fiscal 2012.

The ANTARES® System is a fully automated, single-wafer, Cryokinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. Cryokinetic processing technology is an all-dry, chemical free process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films. The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES system for its defect reduction and yield improvement benefits.

FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray and cryogenic aerosol technologies, customers are able to achieve their process performance flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment.

StreetBeat Disclaimer

Distributed by Viestly