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Leading integrated circuit manufacturers are finding that the unique closed chamber design of the ORION® System, when used for FEOL applications, permits use of high-temperature ViPR™ process technology for all-wet removal of highly implanted photoresist. FSI's differentiated ViPR™ technology minimizes material loss, lowers defectivity and has proven cost of ownership advantages. Other leading device manufacturers recognize that the closed chamber technology of the ORION® System, when used for BEOL applications, delivers highly efficient removal of etch and ash by-products without causing galvanic corrosion or changes in metal and dielectric film properties. The process chamber design with an integrated spray bar, improves uniformity, shortens process time, reduces chemical consumption and enhances particle removal.
FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray and cryogenic aerosol technologies, customers are able to achieve their process performance flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment.
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