Tallahassee, FL 11/14/11 (StreetBeat) --FSI International, Inc. (Nasdaq: FSII), a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced today that several semiconductor producers have placed additional orders for ANTARES® Cryokinetic Cleaning Systems. These device providers currently use the ANTARES® systems for numerous particle removal processes. Unlike aqueous technologies, Cryokinetic cleaning technology is uniquely qualified for particle removal application because of its all-dry defect removal method. The systems are expected to ship during fiscal 2012.The ANTARES® System is a fully automated, single-wafer, Cryokinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. Cryokinetic processing technology is an all-dry, chemical free process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films. The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES system for its defect reduction and yield improvement benefits.
FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray and cryogenic aerosol technologies, customers are able to achieve their process performance flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment.
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