Orlando, FL. 1/25/12 (StreetBeat) -- ISC8, Inc. (OTCBB:IRSN), is pleased to announce the company has signed an agreement with Falcon Electronics to distribute its line of 3D stacked chip and high-speed memory products and services. This new partnership provides a direct channel for ISC8 products into the large system builders and integrators that are looking for either secure components or systems in a package solution for their customers.
The ISC8 portfolio has grown further with the launch of its customizable stacking and packaging designed to meet the increased demand for high reliability and performance in very small form factors by providing small, highly integrated, systems-in-a-cube. This new partnership will provide an additional level of value to Falcon's customers.
Bill Joll, President and CEO of ISC8, commented: "We have ambitious plans for the 3D stacking market. Falcon is the natural choice of partner to help us drive forward given their expertise in selling and delivering superior customer service. Furthermore, their experience with Military and Aerospace customers selling and supporting complimentary technologies from leading vendors make them an ideal strategic partner."
ISC8's time-to-market oriented approach and flexibility are important to our customers," said Brian Diaz, President of Falcon Electronics. "The agreement holds great synergies. By combining ISC8's expertise in this market segment with Falcon's world-class support focus and logistics capabilities will facilitate rapid progression in existing and emerging sectors, and collectively we will grow our share."
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